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1

Influence Of Training Volume And Intensity On Strength And Power Improvements In Experienced, Resistance-trained Men

Mangine, Gerald T., Gonzalez, Adam M., Townsend, Jeremy R., Wells, Adam J., Jajtner, Adam R., Beyer, Kyle S., Boone, Carleigh H., Wang, Ran, Miramonti, Amelia A., LaMonica, Michael B., Fukuda, David H

Journal:

Medicine & Science in Sports & Exercise

Year:

2015

Language:

english

File:

PDF, 279 KB

english, 2015

2

The effect of training volume and intensity on improvements in muscular strength and size in resistance‐trained men

Mangine, Gerald T., Hoffman, Jay R., Gonzalez, Adam M., Townsend, Jeremy R., Wells, Adam J., Jajtner, Adam R., Beyer, Kyle S., Boone, Carleigh H., Miramonti, Amelia A., Wang, Ran, LaMonica, Michael B.

Journal:

Physiological Reports

Year:

2015

Language:

english

File:

PDF, 663 KB

english, 2015

3

Development of sub-10-nm atomic layer deposition barriers for Cu/low-k interconnects

Gerald Beyer, Alessandra Satta, Jörg Schuhmacher, Karen Maex, Wim Besling, Olli Kilpela, Hessel Sprey, Georg Tempel

Journal:

Microelectronic Engineering

Year:

2002

Language:

english

File:

PDF, 1014 KB

english, 2002

4

The Meaning of Solidarity in Catholic Social Teaching

Beyer, Gerald J.

Journal:

Political Theology

Year:

2014

Language:

english

File:

PDF, 276 KB

english, 2014

5

The Love of God and Neighbour according to Aquinas: An Interpretation

Gerald J. Beyer

Journal:

New Blackfriars

Year:

2003

Language:

english

File:

PDF, 1.00 MB

english, 2003

6

A THEORETICAL APPRECIATION OF THE ETHIC OF SOLIDARITY IN POLAND TWENTY-FIVE YEARS AFTER

Gerald J. Beyer

Journal:

Journal of Religious Ethics

Year:

2007

Language:

english

File:

PDF, 502 KB

english, 2007

7

[IEEE 2015 International 3D Systems Integration Conference (3DIC) - Sendai, Japan (2015.8.31-2015.9.2)] 2015 International 3D Systems Integration Conference (3DIC) - Permanent wafer bonding in the low temperature by using various plasma enhanced chemical vapour deposition dielectrics

Kim, Soon-Wook, Peng, Lan, Miller, Andy, Beyer, Gerald, Beyne, Eric, Lee, Chung-Sun

Year:

2015

Language:

english

File:

PDF, 883 KB

english, 2015

8

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Advances in Temporary Bonding and Release Technology for Ultrathin Substrate Processing and High-Density Fan-Out Device Build-up

Phommahaxay, Alain, Podpod, Arnita, Slabbekoorn, John, Sleeckx, Erik, Beyer, Gerald, Beyne, Eric, Guerrero, Alice, Bai, Dongshun, Arnold, Kim

Year:

2018

Language:

english

File:

PDF, 832 KB

english, 2018

9

Evaluations of intrinsic time dependent dielectric breakdown of dielectric copper diffusion barriers

Larry Zhao, Melina Lofrano, Kristof Croes, Els Van Besien, Zsolt Tőkei, Christopher J. Wilson, Robin Degraeve, Thomas Kauerauf, Gerald P. Beyer, Cor Claeys

Journal:

Thin Solid Films

Year:

2011

Language:

english

File:

PDF, 1.14 MB

english, 2011

10

Solidarity by grace, Nature or Both? The Possibility of Human Solidarity in the Light of Evolutionary Biology and Catholic Moral Theology

Beyer, Gerald J.

Journal:

The Heythrop Journal

Year:

2013

Language:

english

File:

PDF, 177 KB

english, 2013

11

The Structure of Scientific Fields and the Functioning of University Graduate Departments

Janice Beyer Lodahl and Gerald Gordon

Journal:

American Sociological Review

Year:

1972

Language:

english

File:

PDF, 2.47 MB

english, 1972

12

Visual Tracking Speed Is Related To Basketball-specific Measures Of Performance In NBA Players

Mangine, Gerald T., Hoffman, Jay R., Wells, Adam J., Gonzalez, Adam M., Rogowski, Joseph P., Townsend, Jeremy R., Jajtner, Adam R., Beyer, Kyle S., Bohner, Johnathan D., Pruna, Gabriel J., Fragala, Ma

Journal:

Medicine & Science in Sports & Exercise

Year:

2014

Language:

english

File:

PDF, 212 KB

english, 2014

13

[IEEE 2016 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2016.11.8-2016.11.11)] 2016 IEEE International 3D Systems Integration Conference (3DIC) - Continuity and reliability assessment of a scalable 3×50μm and 2×40μm via-middle TSV module

Van Huylenbroeck, Stefaan, Li, Yunlong, Stucchi, Michele, Bogaerts, Lieve, De Vos, Joeri, Beyer, Gerald, Beyne, Eric, Brouri, Mohand, Nalla, Praveen, Gopinath, Sanjay, Thorum, Matthew, Richardson, Joe

Year:

2016

Language:

english

File:

PDF, 1.39 MB

english, 2016

14

Texture characterization of Cu interconnects with different Ta-based sidewall diffusion barriers

Christopher J. Wilson, Chao Zhao, Henny Volders, Larry Zhao, Kristof Croes, Zsolt Tőkei, Gerald P. Beyer

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 794 KB

english, 2011

15

Reliability of copper low-k interconnects

Zsolt Tőkei, Kristof Croes, Gerald P. Beyer

Journal:

Microelectronic Engineering

Year:

2010

Language:

english

File:

PDF, 615 KB

english, 2010

16

Impact of “terminal effect” on Cu electrochemical deposition: Filling capability for different metallization options

Silvia Armini, Zsolt Tokei, Henny Volders, Zaid El-Mekki, Aleksandar Radisic, Gerald Beyer, Wouter Ruythooren, Philippe M. Vereecken

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 911 KB

english, 2011

17

Analysis and characterization of a mechanical sensor to monitor stress in interconnect features

Christopher J. Wilson, Kristof Croes, Zsolt Tőkei, Gerald P. Beyer, Barry J. Gallacher, Steve J. Bull, Alton B. Horsfall, Anthony G. O'Neill

Journal:

Thin Solid Films

Year:

2010

Language:

english

File:

PDF, 1.33 MB

english, 2010

18

Diagnostic accuracy of contrast-enhanced FDG-PET/CT in primary staging of cutaneous malignant melanoma

Patrick Veit-Haibach, Florian M. Vogt, Robert Jablonka, Hilmar Kuehl, Andreas Bockisch, Thomas Beyer, Gerlinde Dahmen, Sandra Rosenbaum, Gerald Antoch

Journal:

European Journal of Nuclear Medicine and Molecular Imaging

Year:

2009

Language:

english

File:

PDF, 248 KB

english, 2009

19

Study of metal barrier deposition-induced damage to porous low-k materials

Larry Zhao, Henny Volders, Mikhail Baklanov, Zsolt Tőkei, Marianna Pantouvaki, Christopher J. Wilson, Els Van Besien, Gerald P. Beyer, Cor Claeys

Journal:

Microelectronic Engineering

Year:

2011

Language:

english

File:

PDF, 368 KB

english, 2011

20

exhibition and breeding of binturongs : Arctictis hinturong:family group at Buffalo Zoo

GERALD D. AQUILINA, RICHARD H. BEYER

Journal:

International Zoo Yearbook

Year:

1979

Language:

english

File:

PDF, 313 KB

english, 1979

21

Measurements and Analysis of Substrate Noise Coupling in TSV-Based 3-D Integrated Circuits

Araga, Yuuki, Nagata, Makoto, Van der Plas, Geert, Marchal, Paul, Libois, Michael, Manna, Antonio La, Zhang, Wenqi, Beyer, Gerald, Beyne, Eric

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2014

Language:

english

File:

PDF, 3.79 MB

english, 2014

22

Reliability challenges for barrier/liner system in high aspect ratio through silicon vias

Li, Yunlong, Van Huylenbroeck, Stefaan, Van Besien, Els, Shi, Xiaoping, Wu, Chen, Stucchi, Michele, Beyer, Gerald, Beyne, Eric, De Wolf, Ingrid, Croes, Kristof

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 848 KB

english, 2014

23

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Integration and manufacturing aspects of moving from WaferBOND HT-10.10 to ZoneBOND material in temporary wafer bonding and debonding for 3D applications

Jourdain, Anne, Phommahaxay, Alain, Verbinnen, Greet, Murdoch, Gayle, Miller, Andy, Rebibis, Kenneth, Guerrero, Alice, McCutcheon, Jeremy, Privett, Mark, Neidrich, Jason, Beyer, Gerald, Beyne, Eric

Year:

2013

Language:

english

File:

PDF, 1009 KB

english, 2013

24

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - Line Edge Roughness (LER) correlation and dielectric reliability with Spacer-Defined Double Patterning (SDDP) at 20nm half pitch

Siew, Yong Kong, Stucchi, Michele, Versluijs, Janko, Roussel, Philippe, Kunnen, Eddy, Pantouvaki, Marianna, Beyer, Gerald P., Tokei, Zsolt

Year:

2011

Language:

english

File:

PDF, 387 KB

english, 2011

25

Visual Tracking Speed Is Related to Basketball-Specific Measures of Performance in NBA Players

Mangine, Gerald T., Hoffman, Jay R., Wells, Adam J., Gonzalez, Adam M., Rogowski, Joseph P., Townsend, Jeremy R., Jajtner, Adam R., Beyer, Kyle S., Bohner, Jonathan D., Pruna, Gabriel J., Fragala, Mar

Journal:

The Journal of Strength and Conditioning Research

Year:

2014

Language:

english

File:

PDF, 262 KB

english, 2014

26

Solidarity and Occupy Wall Street: A Tale of Two Movements

Journal:

Political Theology

Year:

2012

Language:

english

File:

PDF, 499 KB

english, 2012

27

Umwandlung in die Aktiengesellschaft – Steuerliche Nachteile?

SCHÜRMANN, WALTER, BEYER, GERALD

Journal:

Zeitschrift für Unternehmens und Gesellschaftsrecht

Year:

1981

Language:

german

File:

PDF, 4.50 MB

german, 1981

28

ECS Transactions [ECS 218th ECS Meeting - Las Vegas, NV (October 10 - October 15, 2010)] - Ultra Low-k Materials: Challenges of Scaling

Zhao, Larry, Baklanov, Mikhail, Pantouvaki, Marianna, Tőkei, Zsolt, Beyer, Gerald

Year:

2010

Language:

english

File:

PDF, 551 KB

english, 2010

29

Don't Worry About the Election

Beyer, Scott B, Jensen, Gerald R, Johnson, Robert R

Journal:

The Journal of Portfolio Management

Year:

2004

Language:

english

File:

PDF, 98 KB

english, 2004

30

Properties of Tin Thin Films Deposited by Alcvd as Barrier for Cu Metallization

Satta, Alessandra, Beyer, Gerald, Maex, Karen, Elers, Kai, Haukka, Suvi, Vantomme, A.

Journal:

MRS Proceedings

Year:

2000

Language:

english

File:

PDF, 301 KB

english, 2000

31

Exercise-Induced Hormone Elevations Are Related To Muscle Growth

Mangine, Gerald T., Hoffman, Jay R., Gonzalez, Adam M., Townsend, Jeremy R., Wells, Adam J., Jajtner, Adam R., Beyer, Kyle S., Boone, Carleigh H., Wang, Ran, Miramonti, Amelia A., LaMonica, Michael B.

Journal:

The Journal of Strength and Conditioning Research

Year:

2016

Language:

english

File:

PDF, 422 KB

english, 2016

32

Performance and Muscle Architecture Comparisons Between Starters and Nonstarters in National Collegiate Athletic Association Division I Womenʼs Soccer

Jajtner, Adam R., Hoffman, Jay R., Scanlon, Tyler C., Wells, Adam J., Townsend, Jeremy R., Beyer, Kyle S., Mangine, Gerald T., McCormack, William P., Bohner, Jonathan D., Fragala, Maren S., Stout, Jef

Journal:

The Journal of Strength and Conditioning Research

Year:

2013

Language:

english

File:

PDF, 126 KB

english, 2013

33

Longitudinal Assessment of Student Learning: Simplistic Measures Aren't Enough

Catharine Hoffman Beyer and Gerald M. Gillmore

Journal:

Change The Magazine of Higher Learning

Year:

2007

Language:

english

File:

PDF, 1.36 MB

english, 2007

34

[IEEE 2016 6th Electronic System-Integration Technology Conference (ESTC) - Grenoble, France (2016.9.13-2016.9.15)] 2016 6th Electronic System-Integration Technology Conference (ESTC) - Liquid mediated direct bonding and bond propagation

Dubey, Vikas, Derakhshandeh, Jaber, O'Callaghan, John M., Willems, Kherim, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, De Wolf, Ingrid, Beyne, Eric

Year:

2016

Language:

english

File:

PDF, 884 KB

english, 2016

35

[IEEE 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Wuhan, China (2016.8.16-2016.8.19)] 2016 17th International Conference on Electronic Packaging Technology (ICEPT) - Development of multi-stack dielectric wafer bonding

Peng, Lan, Kim, Soon-Wook, Inoue, Fumihiro, Wang, Teng, Phommahaxay, Alain, Verdonck, Patrick, Jourdain, Anne, De Vos, Joeri, Sleeckx, Erik, Struyf, Herbert, Miller, Andy, Beyer, Gerald, Beyne, Eric,

Year:

2016

Language:

english

File:

PDF, 960 KB

english, 2016

36

Advocating Worker Justice

Beyer, Gerald J.

Journal:

Journal of Religious Ethics

Year:

2017

Language:

english

File:

PDF, 158 KB

english, 2017

37

[IEEE 2017 IEEE International Interconnect Technology Conference (IITC) - HsinChu, Taiwan (2017.5.16-2017.5.18)] 2017 IEEE International Interconnect Technology Conference (IITC) - Growth rate of IMC in the binary sytems of Co/Sn and Cu/Sn

Nagano, Fuya, Kajihara, Masanori, Derakhshandeh, Jaber, Hou, Lin, Peer, Myriam Van De, Preter, Inge De, Sharifi, Shamin Houshmand, Rebibis, Kenneth June, Miller, Andy, Beyer, Gerald, Beyne, Eric

Year:

2017

Language:

english

File:

PDF, 424 KB

english, 2017

38

Comparison Of Electrical Stimulation Versus Cold Water Immersion On Treatment Of Muscle Soreness Following Resistance Exercise

Jajtner, Adam, Hoffman, Jay R., Gonzalez, Adam M., Townsend, Jeremy R., Wells, Adam J., Beyer, Kyle S., Mangine, Gerald T., Scanlon, Tyler M., Boone, Carleigh H., Pruna, Gabriel J., Bohner, Jonathan D

Journal:

Medicine & Science in Sports & Exercise

Year:

2014

Language:

english

File:

PDF, 213 KB

english, 2014

39

High-Intensity Resistance Training Increases Upper Body Muscle and Bone Variables in Resistance Trained Males

Church, David D., Mangine, Gerald T., Gonzalez, Adam M., Townsend, Jeremy R., Wells, Adam J., Jajtner, Adam R., Beyer, Kyle S., Boone, Carleigh H., Wang, Ran, Miramonti, Amelia A., LaMonica, Michael B

Journal:

Medicine & Science in Sports & Exercise

Year:

2015

Language:

english

File:

PDF, 206 KB

english, 2015

40

Increased Proportion Of Lymphocytes Expressing Androgen And Interferon-gamma Receptors Following High Volume Resistance Exercise

Jajtner, Adam R., Hoffman, Jay R., Fragala, Maren S., Townsend, Jeremy R., Gonzalez, Adam M., Beyer, Kyle S., Wells, Adam J., Boone, Carleigh H., Wang, Ran, Robinson, Edward H., Mangine, Gerald T., Ol

Journal:

Medicine & Science in Sports & Exercise

Year:

2015

Language:

english

File:

PDF, 207 KB

english, 2015

41

Etch process modules development and integration in 3D SOC applications

Tutunjyan, Nina, Sardo, Stefano, De Vos, Joeri, Van Huylenbroeck, Stefaan, Jourdain, Anne, Peng, Lan, Inoue, Fumihiro, Rassoul, Nouredine, Beyer, Gerald, Beyne, Eric, Miller, Andy, Piumi, Daniele

Journal:

Microelectronic Engineering

Year:

2018

Language:

english

File:

PDF, 1.35 MB

english, 2018

42

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - A Unique Temporary Bond Solution Based on a Polymeric Material Tacky at Room Temperature and Highly Thermally Resistant Application Extension from 3D-SIC to FO-WLP

Phommahaxay, Alain, Potoms, Goedele, Bertheau, Julien, Bex, Pieter, Duval, Fabrice, Podpod, Arnita, Wang, Teng, Verbinnen, Greet, Beyer, Gerald, Sleeckx, Erik, Beyne, Eric, Nakamura, Atsushi, Kamochi,

Year:

2017

Language:

english

File:

PDF, 1.90 MB

english, 2017

43

[IEEE 2018 IEEE International Reliability Physics Symposium (IRPS) - Burlingame, CA (2018.3.11-2018.3.15)] 2018 IEEE International Reliability Physics Symposium (IRPS) - TSV process-induced MOS reliability degradation

Li, Yunlong, Stucchi, Michele, Van Huylenbroeck, Stefaan, Van Der Plas, Geert, Beyer, Gerald, Beyne, Eric, Croes, Kristof

Year:

2018

Language:

english

File:

PDF, 808 KB

english, 2018

44

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Extreme Thinned-Wafer Bonding Using Low Temperature Curable Polyimide for Advanced Wafer Level Integrations

Bertheau, Julien, Inoue, Fumihiro, Phommahaxay, Alain, Peng, lan, Iacovo, Serena, Rassoul, Nouredine, Sleeckx, Erik, Rebibs, Kenneth, Miller, Andy, Beyer, Gerald, Beyne, Eric, Nakamura, Atsushi

Year:

2018

Language:

english

File:

PDF, 535 KB

english, 2018

45

[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Extreme Thinning of Si Wafers for Via-Last and Multi-wafer Stacking Applications

Jourdain, Anne, De Vos, Joeri, Rassoul, Nouredine, Zahedmanesh, Houman, Miller, Andy, Beyer, Gerald, Beyne, Eric, Walsby, Edward, Patel, Jash, Ansell, Oliver, Ashraf, Huma, Thomas, Dave, Li, Shifang,

Year:

2018

Language:

english

File:

PDF, 1.25 MB

english, 2018

46

[IEEE 2018 IEEE International Interconnect Technology Conference (IITC) - Santa Clara, CA, USA (2018.6.4-2018.6.7)] 2018 IEEE International Interconnect Technology Conference (IITC) - A Highly Reliable 1×5μm Via-last TSV Module

Van Huylenbroeck, Stefaan, Li, Yunlong, De Vos, Joeri, Jamieson, Geraldine, Tutunjyan, Nina, Miller, Andy, Beyer, Gerald, Beyne, Eric

Year:

2018

Language:

english

File:

PDF, 2.27 MB

english, 2018

47

Influence of Composition of SiCN as Interfacial Layer on Plasma Activated Direct Bonding

Inoue, Fumihiro, Peng, Lan, Iacovo, Serena, Phommahaxay, Alain, Verdonck, Patrick, Meersschaut, Johan, Dara, Praveen, Sleeckx, Erik, Miller, Andy, Beyer, Gerald, Beyne, Eric

Journal:

ECS Journal of Solid State Science and Technology

Year:

2019

Language:

english

File:

PDF, 909 KB

english, 2019

48

The impact of occasional drought periods on vegetation spread and greenhouse gas exchange in rewetted fens

Koebsch, Franziska, Gottschalk, Pia, Beyer, Florian, Wille, Christian, Jurasinski, Gerald, Sachs, Torsten

Journal:

Philosophical Transactions Biological Sciences

Year:

2020

File:

PDF, 785 KB

2020

49

An interinstitutional and interspecialty comparison of treatment outcome data for patients with prostate carcinoma based on predefined prognostic categories and minimum follow-up

Frank A. Vicini, Alvaro Martinez, Gerald Hanks, Alex Hanlon, Brian Miles, Ken Kernan, David Beyers, Haakon Ragde, Jeffrey Forman, James Fontanesi, Larry Kestin, Gyorgy Kovacs, Louis Denis, Kevin Slawi

Journal:

Year:

2002

Language:

english

File:

PDF, 88 KB

english, 2002

50

Materials for advanced metallization MAM2004

Gerald Beyer, Karen Maex, Muriel de Potter

Journal:

Microelectronic Engineering

Year:

2004

File:

PDF, 15 KB

2004

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